The Key Advantages of Grid Release Film You Might Not Know
Publish Time: 2025-09-29
Grid Release Film is a type of industrial functional thin film featuring a surface textured with grid patterns. The raised grid reduces the contact area with adhesive tapes, enhancing release performance. Simultaneously, the grid structure provides an automatic venting function, preventing air bubbles during lamination. Typical specifications include thicknesses of 50–150 μm and widths of 1080 mm (customizable). Grid shapes can be designed as square, diamond, or hexagonal, with grid sizes ranging from 0.05 mm to 2.0 mm, spacing from 0.03 mm to 0.3 mm, and heights from 0.003 mm to 0.05 mm. Its core functions include release performance, air venting, and protection/support, making it highly versatile for electronics, construction, and adhesive product applications.
1. Core Definition and Functional Features
The Grid Release Film is engineered to provide reliable low-force release, achieving peel strengths as low as 0.1 N/25 mm using silicone, fluoropolymer, or non-silicone coatings (light release type). This makes it suitable for repeated peeling of high-adhesion tapes without leaving residues. Its grid structure guides trapped air out during bonding, improving lamination efficiency and surface smoothness—particularly important for electronic components, LCD light guide plates, and architectural applications. Additionally, the film acts as a temporary protective layer during adhesive or electronic material processing, preventing contamination or damage while providing structural support for complex components. This combination of release performance, venting, and protection makes Grid Release Film an essential industrial material.
2. Material Selection and Compatibility Principles
Substrate Systems: PET, PI, and BOPP are commonly used. PET (25–125 μm) balances mechanical strength and cost; PI withstands high temperatures ≥200 °C, ideal for flexible circuits; BOPP is low-temperature resistant, suitable for packaging. Special substrates include PEEK for extreme environments, paper-based films for cost-effective applications, and PE/CPP composites for enhanced flexibility.
Coating Materials: Silicone release agents, either solvent-based or solvent-free (0.8–1.5 g/m²), form a stable release layer with heat resistance up to 180 °C. Fluoropolymer coatings provide ultra-low friction and chemical resistance, suitable for high-viscosity silicone protective films. Non-silicone coatings offer moderate peel force and chemical resistance for complex environments. Functional coatings include anti-static treatments (surface resistance ≤1×10⁶ Ω), UV-cured layers for weather resistance, and nano-alumina for high-temperature stability.
3. Processing Techniques and Technological Innovations
Forming Processes: Coating uses patterned rollers to transfer resin grid layers and micro-engraved silicone release agents with ±0.1 g/m² precision, cured by heat or UV (energy ≥300 mJ/cm²). Embossing rollers create grid textures with rim treatments to increase surface tension (≤30 mN/m) and enhance coating adhesion. Composite processes such as PET + silicone release layer + resin grid layer are laminated under pressure, cooled, trimmed, and rolled.
Process Parameter Control: Grid dimensions: length 0.05–2.0 mm, spacing 0.03–0.3 mm, height 0.003–0.05 mm, hardness 50–70A. Curing conditions: drying at 60–145 °C, speed 30–70 m/min to ensure uniform coatings. Tension control during unwinding/rewinding ≤50 N prevents substrate deformation.
4. Quality Control and Inspection Standards
Key Performance Indicators: Light-release type ≤0.1 N/25 mm, heavy-release type 0.5–2.0 N/25 mm (180° peel, GB/T 2792). Residual adhesion ≤1.0 % (UV spectrophotometry) to ensure no leftover adhesive. Thickness uniformity ±5 % (GB/T 6672), surface roughness Ra ≤0.8 μm.
Temperature and Environmental Resistance: Stable peel force at 150 °C for 1 hour (±20 %, GB/T 1735), no cracking at -40 °C for 24 hours (ISO 4649). Damp-heat aging: 85 °C / 85% RH for 500 hours, no coating detachment or substrate deformation. Environmental safety: solvent residues (toluene/ethyl acetate) ≤5 mg/m² (GC-MS), heavy metal migration meets EN 71-3, RoHS compliance. Testing methods include GB/T 25256, ASTM D3330, ISO 29862, using coordinate measurement, spectroscopy, and weathering tests.
5. Application Scenarios and Typical Cases
Electronics Manufacturing: Used for flexible circuit boards (FPC), MLCC release films, and LCD light guide plates. For example, 5G antenna FPC uses PI substrate with nano-alumina coating, resistant to 180 °C, with a peel force of 0.08 N/25 mm.
Architectural Decoration: PTFE grid films applied to stadiums and commercial building facades, such as Shanghai Xihongqiao First Shopping Center, use B1-rated flame-retardant mesh films with 28% open area, achieving semi-transparency for shading and thermal insulation.
Automotive Industry: TPU vehicle films and heat insulation release films maintain stable release forces at high temperatures, compatible with TPU cast film processes.
Packaging and Medical: PET grid protective films for food packaging and medical instruments, such as surgical instrument protective layers, feature strong weather resistance and leave no adhesive residue.
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