What are some special applications of industrial high-temperature resistant protective films in semiconductor manufacturing?
Publish Time: 2025-12-26
In the electronics manufacturing field, especially in the highly precise semiconductor manufacturing process, industrial high-temperature resistant protective films not only provide basic physical protection but also play an irreplaceable role in several key processes. Besides the well-known applications of PCB gold plating masking and high-temperature soldering protection, these high-performance films also demonstrate unique value in wafer fabrication, photolithography, and packaging testing.
1. Temporary Bonding and Debonding Protection in Wafer Manufacturing
In advanced processes, "temporary bonding" is often used to improve wafer strength and prevent cracking during thinning. In this case, high-temperature resistant PI or modified PET protective films are used as temporary adhesive layers, maintaining stable adhesion even at temperatures above 200°C and exhibiting no residual peeling during subsequent laser or thermal debonding steps. This application places extremely high demands on the thermal stability, cleanliness, and low gas release performance of the protective film.
2. Edge Protection in Photolithography and Etching Processes
During photolithography and dry/wet etching processes, wafer edges are highly susceptible to damage from chemical splashes or plasma bombardment. Therefore, semiconductor manufacturers often apply a high-temperature, chemically resistant fluoropolymer protective film to the wafer edges. This film must maintain its integrity in strong acid, strong alkali, and high-energy plasma environments to effectively prevent edge defects from spreading to the chip area, thereby improving yield.
3. Surface Isolation in High-Temperature Annealing and Diffusion Processes
In high-temperature annealing or doping diffusion processes after ion implantation, wafers need to be heated for extended periods in an inert or oxidizing atmosphere at 800℃–1100℃. Direct exposure at this temperature can easily lead to surface oxidation or contamination. Some advanced production lines use ultra-clean, low-metal-ion-content quartz fiber-reinforced PI films or ceramic-coated composite films for localized coverage, achieving selective heat treatment while preventing unnecessary reactions in non-target areas.
4. Temporary Carrier Protection in Advanced Packaging
In advanced packaging technologies such as Fan-Out and Chiplet, the reconstructed wafer needs to be temporarily fixed to a carrier for rewiring and encapsulation. This process involves multiple high-temperature curing cycles. High-temperature resistant PI or LCP protective films are used to isolate the interface between the chip and the carrier, prevent epoxy resin overflow from contaminating the chip surface, and achieve clean peeling during debonding, ensuring packaging reliability.
5. Protective Lining for Equipment Cavities and Fixtures
The internal cavities and wafer fixtures of semiconductor manufacturing equipment are exposed to high temperatures, high vacuum, and corrosive gases for extended periods, making them prone to particulate contamination. To extend equipment life and reduce maintenance frequency, engineers apply PTFE, PI, or ceramic-based high-temperature resistant protective films as "sacrificial layers" to critical areas. These films not only withstand extreme process environments but also effectively adsorb or block metal sputterings and byproduct deposition, maintaining process cleanliness.
With the continuous miniaturization of semiconductor process nodes and the increasing prevalence of 3D integration, industrial high-temperature resistant protective films have risen from "auxiliary materials" to "critical process media." Its deep penetration into multiple dimensions such as wafer manufacturing, packaging, and equipment maintenance not only reflects the integration and innovation of materials science and micro-nano manufacturing, but also provides solid support for the more complex, higher-temperature, and cleaner semiconductor production in the future.
