Characteristics Material nature: It is a thermal interface material based on silicone oil and supplemented with thermal conductive fillers (such as alumina, boron nitride, silver powder, carbon particles, etc.), which has both thermal conductivity and electrical insulation properties.
Key features High thermal conductivity: Effectively reduces thermal resistance and enhances the heat conduction efficiency between electronic components (such as CPU/GPU) and heat sinks, with thermal resistance reduced by 30% to 50%. Electrical insulation and weather resistance: Low dielectric constant, resistant to high and low temperatures, UV, chemical corrosion, and non-corrosive to metals (copper/aluminum/steel). Process compatibility: Adjustable viscosity (thin to thick), suitable for dispensing, printing or manual application. It does not cure, does not volatilize, and has excellent long-term stability. Environmental protection and safety: Non-toxic and odorless, in compliance with RoHS/REACH standards, and some bio-based formulas reduce carbon footprint by 25%.
Application scenarios Electronic heat dissipation: CPU/GPU, power modules, memory sticks, LED lamps (such as street lamps/stage lamps), high-power IGBT modules (for new energy vehicles/inverters). Industry and Communications: 5G base station RF modules, data center servers, PLCS/frequency converters, servo drives, industrial motors. Consumer electronics: SoC cooling for flagship mobile phones/tablets, processors for gaming devices /VR headsets, high-performance SSDS/memory modules. New energy and automobiles: Battery Management System (BMS) cell heat conduction, power semiconductor (SiC/GaN) heat dissipation, on-board charging module (OBC). Special scenarios: Aerospace radiation-resistant components, sterile sealing of medical devices, heat dissipation of high-brightness LED lamps.
