Characteristics Material nature: A composite material with a resin matrix (such as epoxy resin, silicone, polyurethane) as the carrier and thermal conductive fillers (such as alumina, boron nitride, carbon-based materials) added. Typical products such as Dow's silicone potting compound and Henkel's epoxy resin system have two-component (A/B) or one-component formulations and support room temperature/heating curing. Key features High thermal conductivity: Thermal conductivity coefficient 0.6-5.2 W/(m·K), effectively reducing the junction temperature of electronic components (for example, the temperature difference of IGBT modules in new energy vehicles is reduced from 35℃ to 12℃). Electrical insulation and weather resistance: UL94 V-0 flame retardant, resistant to a wide temperature range of -60 ° C to 260 ° C, UV, acid, alkali and moisture, protecting components from environmental erosion. Mechanical protection: Low viscosity leveling property (such as the viscosity of Taiya products as low as 1200 mPa·s), filling fine gaps; After curing, it forms an elastomer that buffers mechanical stress (for example, the tensile strength change is less than 5% after 1000 cycles of cold and heat shock). Environmental protection and safety: Compliant with RoHS/REACH standards, low VOC emissions (< 50 ppm), and some bio-based formulas reduce carbon footprint by 25%.
Application scenarios New energy field Electric vehicles: Potting of battery modules (such as BMS systems), electric drive systems, and OBC on-board charging modules to solve the heat dissipation problem of SiC power modules at a working temperature of 175℃. Energy storage system: Inverter, photovoltaic junction box, internal heat conduction and sealing of battery pack, improving thermal management efficiency. Electronics and Communications 5G base stations: Potting of power amplifiers and RF modules. Each base station requires 2-3 kilograms of glue. The growth in the number of global base stations is driving demand. Consumer electronics: LED lamps, mobile phone cpus, notebook heat dissipation modules, thermal sealing for smart wearable devices. Industrial and special Equipment Aerospace: Radiation-resistant potting compound (unit price over 800 yuan per kilogram), meeting the reliability requirements in extreme environments. Medical devices: Aseptic packaging, biological sample label release layer, ensuring hygiene and easy peeling. Others: Protection of precision components such as transformers, sensors, relays, and optical fiber equipment. Key manufacturers and products International brand Dow: 30% plant-based bio-based potting compound, reducing carbon footprint by 25%. Henkel: High thermal conductivity epoxy resin system, thermal conductivity > 1.5 W/(m·K), suitable for aerospace requirements. 3M: Optically Clear Adhesive series, which combines thermal conductivity and optical transparency. Domestic manufacturers Aochuan Technology: Provides high thermal conductivity silicone potting compound, with temperature resistance ranging from -50℃ to 200℃, and has passed ISO 9001 certification. Huatian New Materials: Epoxy resin potting compound, with a thermal conductivity of 1.2-3.0 W/(m·K), is applied in new energy vehicles. Huirui Adhesive Industry: Two-component silicone potting compound, 1:1 mixing ratio, suitable for automated dispensing equipment.
