Characteristics
Material nature: One-component/two-component adhesives based on acrylate generate free radicals by stimulating photoinitiators with ultraviolet light (365-395nm wavelength) to initiate polymerization reactions and achieve rapid curing.
Key features
Rapid curing: Curing is completed within seconds to tens of seconds, enhancing production efficiency (for example, electronic flat cables are initially fixed in 1 to 5 seconds and reach high strength in 30 seconds).
High transparency and optical performance: After curing, the light transmittance is ≥90%, and the refractive index is adjustable. It is suitable for bonding optical lenses and display screens.
Strong adhesion: Compatible with various materials such as glass, metal, and plastic (like PMMA, PC, ABS), with high peel strength and excellent weather resistance (resistant to temperature differences from -40 ° C to 150 ° C, and UV yellowing).
Environmental protection and safety: Compliant with RoHS and REACH standards, low VOC emissions, and some bio-based formulas reduce carbon footprint by 25%.
Process compatibility: Supports automated operations such as dispensing, spraying, and screen printing, and is compatible with UVLED curing equipment.
Application scenarios
Electronics and Optics
Full lamination of display screens (such as eliminating bubbles on OLED screens), fixation of camera modules, bonding of LED lenses, and three-proof protection of PCB boards.
Bonding of optical fiber communication devices, AR/VR optical modules, and electrochromic glass (such as the sunroof of new energy vehicles).
Industry and Automobiles
Automobile lampshade sealing, battery module packaging, FPC ribbon cable protection, sensor fixation.
Aerospace radiation-resistant component bonding, aseptic packaging of medical devices (such as assembly of disposable equipment).
Consumption and Creativity
Handicrafts (crystal, glass) bonding, home decoration (such as glass furniture), DIY handicrafts (model making), assembly of smart wearable devices.
Emerging fields
Heat dissipation for 5G base station power modules, thermal conduction sealing for new energy battery packs, and bending protection for flexible circuit boards (FPC).
